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Shenzhen Tengshengda ELECTRIC CO., LTD.

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Province/State:guangdong

Country/Region:china

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XCZU19EG-3FFVD1760E

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Package / Case :1760-BBGA, FCBGA

Product Category :Systems on a Chip - SoC

Primary Attributes :Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

Speed :600MHz, 667MHz, 1.5GHz

Supplier Device Package :1760-FCBGA (42.5x42.5)

Flash Size :-

RAM Size :256kB

Connectivity :CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Operating Temperature :0°C ~ 100°C (TJ)

Package :Tray

Architecture :MCU, FPGA

Core Processor :Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Product status :Active

Peripherals :DMA, WDT

Series :Zynq® UltraScale+™ MPSoC EG

Manufacturer :Xilinx Inc

Description :IC SOC CORTEX-A53 1760FCBGA

Stock :In Stock

Shipping Method :LCL, AIR, FCL, Express

Payment Terms :L/C, D/A, D/P, T/T, Western Union, MoneyGram

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The XCZU19EG-3FFVD1760E,from Xilinx Inc,is Systems on a Chip - SoC.what we offer have competitive price in the global market,which are in original and new parts.If you would like to know more about the products or apply a lower price, please contact us through the “online chat” or send a quote to us!

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